Apparatus for Detecting a Pre-Aligning Element at a Wafer

ABSTRACT

An apparatus for detecting a pre-aligning element at a wafer and a method for pre-aligning a wafer are disclosed. In an embodiment, the apparatus includes a sensor arrangement configured to illuminate subsequent edge portions of the wafer edge and to output a first and a second sensor signal, wherein the first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination; and an evaluation unit configured to evaluate the first sensor signal and to determine a first position information indicating a coarse position of the pre-aligning element, and, after having determined the first position information, to determine a second position information based on the second sensor signal and the first position information, wherein the second position information indicates a fine position of the pre-aligning element.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/936,050, filed Jul. 5, 2013, and entitled “Apparatus for Detecting aPre-Aligning Element at a Wafer,” which application is incorporatedherein by reference.

TECHNICAL FIELD

The invention relates to apparatus and methods for aligningsemiconductor substrates or wafers carried by a support.

Embodiments relate to an apparatus for detecting a pre-aligning elementat a wafer. Further embodiments relate to a pre-aligning system foraligning a wafer. Further embodiments relate to a method for detecting apre-aligning element at a wafer. Other embodiments relate to a methodfor pre-aligning a wafer.

BACKGROUND

Wafers are structures comprising semiconductor material, e.g. silicon.The semiconductor material comprises a crystallographic orientation,which is indicated by pre-aligning elements at the wafer, e.g. notchesor flats. For a processing of a wafer the crystallographic orientationof the semiconductor material and therefore the orientation of thepre-aligning element has to be detected.

SUMMARY OF THE INVENTION

Embodiments provide an apparatus for detecting a pre-aligning element ata wafer, the wafer having the pre-aligning element at a wafer edge. Theapparatus comprises a sensor arrangement and an evaluation unit. Thesensor arrangement is configured to illuminate subsequent edge portionsof the wafer edge, to receive transmitted fractions and reflectedfractions of the illumination from the illuminated edge portions with anillumination sensor and to output a first and a second sensor signal,wherein the first sensor signal is based on the transmitted fractions ofthe illumination and the second sensor signal is based on the reflectedfractions of the illumination. The evaluation unit is configured toevaluate the first sensor signal and to determine a first positioninformation with respect to a coarse position of the pre-aligningelement if the first sensor signal indicates that the transmittedfractions of the illumination have reached a predetermined thresholdvalue, wherein the first position information indicates that thepre-aligning element is at least partially located within the currentlyevaluated edge portion, and after having determined the first positioninformation to determine a second position information based on thesecond sensor signal and the first position information, wherein thesecond position information indicates the fine position of thepre-aligning element.

Further embodiments provide a method for detecting a pre-aligningelement at a wafer, wherein the wafer has the pre-aligning element at awafer edge. Subsequent edge portions of the wafer edge are illuminatedwith a sensor arrangement and transmitted fractions and reflectedfractions of the illumination are received from the illuminated edgeportion with an illumination sensor. A first and a second sensor signalare outputted, wherein the first sensor signal is based on thetransmitted fractions of the illumination and the second sensor signalis based on the reflected fractions of the illumination. The firstsensor signal is evaluated with an evaluation unit and a first positioninformation is determined with respect to a coarse position of thepre-aligning element if the first sensor signal indicates that thetransmitted fractions of the illumination have reached a predeterminedthreshold value. The first position information indicates thatpre-aligning element is at least partially located within the currentlyevaluated edge portion. After having determined the first positioninformation, a second position information is determined based on thesecond sensor signal and the first position information, wherein thesecond position information indicates the fine position of thepre-aligning element.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are described herein makingreference to the appended drawings.

FIG. 1 shows a schematic block diagram of an apparatus for detecting apre-aligning element at a wafer according to an embodiment;

FIG. 2 shows a schematic side view of an apparatus for detecting apre-aligning element according to another embodiment;

FIG. 3 shows a schematic side view of an apparatus for detecting apre-aligning element according to another embodiment;

FIG. 4a shows a schematic side view of an apparatus for detecting apre-aligning element according to an embodiment;

FIG. 4b shows a schematic top view of the apparatus of FIG. 4 a;

FIG. 5a shows a section of a top view on the pre-aligning element of thewafer according to an embodiment in an optimal case;

FIG. 5b shows a section of a top view on the pre-aligning elementaccording to the embodiment shown in FIG. 5a in a realistic scenario;

FIG. 6 shows a flowchart of a method for detecting a pre-aligningelement at a wafer shown in FIG. 4 a;

FIG. 7 shows a flowchart of another method for detecting a pre-aligningelement at a wafer shown in FIG. 4 a.

DETAILED DESCRIPTION OF THE INVENTION

Equal or equivalent elements or elements with equal or equivalentfunctionality are denoted in the following description by equal orequivalent reference numerals.

In the following description, a plurality of details are set forth toprovide a more thorough explanation of embodiments of the presentinvention. However, it will be apparent to those skilled in the art thatembodiments of the present invention may be practiced without thesespecific details. In other instances, well known structures and devicesare shown in block diagram form rather than in detail in order to avoidobscuring embodiments of the present invention. In addition, features ofthe different embodiments described hereinafter may be combined witheach other, unless specifically noted otherwise.

FIG. 1 shows a block diagram of an apparatus 10 for detecting apre-aligning element 12 at a wafer edge of a wafer 16, the apparatus 10comprising a sensor arrangement 22 and an evaluation unit 42. Thepre-aligning element 12 is configured to indicate an orientation of thewafer 16. The wafer 16 may have flats or crystallographic orientationnotches at one or more sides as a pre-aligning element indicating acrystallographic orientation of the wafer 16.

The sensor arrangement 22 is configured to illuminate subsequent edgeportions of the wafer edge, to receive transmitted fractions 26-1 andreflected fractions 26-2 of the illumination from the illuminated edgeportions with an illumination sensor 34, and to output a first and asecond sensor signal 28-1 and 28-2, wherein the first sensor signal 28-1is based on the transmitted fractions 26-1 of the illumination and thesecond sensor signal is based on the reflected fractions 26-2 of theillumination.

The evaluation unit 42 is configured to evaluate the first sensor signal28-1 and to determine a first position information with respect to acoarse position of the pre-aligning element if the first sensor signal28-1 indicates that the transmitted fractions 26-1 of the illuminationhave reached a predetermined threshold value, wherein the first positioninformation indicates that pre-aligning element 12 is at least partiallylocated within the currently evaluated edge portion. The evaluation unit42 is further configured to determine a second position informationbased on the second sensor signal 28-2 and the first positioninformation after having determined the first position information,wherein the second position information indicates the fine (precise)position of the pre-aligning element with respect to a referenceposition. The reference position may be an intersection of coordinateaxes or any other defined point of the coordinate system. The referenceposition may be associated to a current orientation of the steppermotor. The coordinate system may comprise any type of coordinates, e.g.Cartesian or polar. Different types of coordinates may be transformed orconverted into each other. A position within this coordinate system maybe associated to the second position information. As a result, acoordinate system may be spanned across the wafer, wherein the wafer islocated at a known position of the coordinate system with a knownorientation. The reference position may be associated for example to acurrent orientation of a stepper motor, e.g. a current step of the motorwithin a defined number of steps describing a full rotation of thestepper motor or an angle of a motor shaft of the stepper motor withrespect to a defined angle, e.g. zero degrees.

The pre-aligning may be done by a wafer stepper or other apparatusconfigured to process wafers. Actually, the pre-aligning element, e.g. anotch or a flat, can be searched by the steppers utilizing transmittedillumination and by matching a detected pattern to an expected patternof the pre-aligning element. The pre-alignment is a positioning of thewafer before loading it on a process chuck. A task herein is, thatsteppers are unable to reliably detect pre-aligning elements, due toresiduals of adhesives which shift the detected pattern of thepre-aligning element and therefore the steppers reject the discs,discard it respectively, which leads to increased costs. The adhesive isused to fix the wafer to a wafer support and residuals of the adhesivelocated nearby the pre-aligning element cause additional absorption orblocking of transmitted illumination causing errors, as described inexemplary in FIGS. 5a and 5b . To improve the chance of detection, thenotch can be cleaned after mounting it to the stepper, wherein a successrate of the method is less than 100%. Some of the rest of the wafershave to be discarded.

A portion of the transmitted fractions 26-1 of the illumination andtherefore the first sensor signal 28-1 depends on a portion ofillumination emitted by the illumination source 32 towards theillumination sensor 34 which is not blocked, absorbed or reflected bythe wafer 16 or the wafer support 14 which may carry the wafer to form awafer arrangement. The wafer support 14 may comprise an at leastpartially a transparent material, e.g. glass or a transparent syntheticmaterial (plastic) configured to let pass illumination emitted by theillumination source 32. The wafer edge is arranged with respect to theillumination source 32 and the illumination sensor 34 in a way that theportion of the transmitted fractions 26-1 of the illumination is varyingdepending on a shape of the wafer edge, i.e. is based on at least apartially presence or an absence of the pre-aligning element within thecurrently illuminated edge portion. In case the pre-aligning element 12is located at least partially and therefore present within the currentlyilluminated edge portion and therefore within a first range ofdetection, the currently transmitted fraction 26-1 comprises adifferent, e.g. a higher, portion than if the pre-aligning element 12 islocated outside the edge portion. In case of an absence of thepre-aligning element 12 with respect to the first range of detection,the wafer 16 absorbs or blocks a higher share of the illumination whichleads to a lower level of the transmitted fractions 26-1 of theillumination.

The first position information based on the transmitted fractions 28-2of the illumination indicates a coarse position of the pre-aligningelement inasmuch as reaching the predetermined threshold value by thefirst sensor signal 28-1 indicates the position of the pre-aligningelement 12 to be positioned within the currently illuminated edgeportion, within the first range of detection respectively. The portionof the transmitted fractions 26-1 is dependent on the actual position ofthe pre-aligning element within the illuminated edge portion as well asfrom other effects which reduce the transmission of the illuminationemitted by the illumination source 32, e.g. adhesive residuals at thewafer 16 or at a wafer support.

Reflected portions of the illumination indicate the position of thepre-aligning element with a high accuracy as a matching of patterns ofthe detected pre-aligning element with expected patterns of thepre-aligning element can be performed. A matching of a currentlyevaluated pattern with the expected pattern, e.g. by a mathematicalalgorithm or a software, therefore enables to evaluate the fine positionof the pre-aligning element. Thus, the first position information givesa reliable information about the presence of the pre-aligning elementwithin a certain area, e.g. the illuminated edge portions, and a coarseinformation about the position of the pre-aligning element within thisrange, whereas the second position information gives a more accurateinformation about the exact position of the pre-aligning element. Theapparatus is configured to combine both aspects so that the method isunaffected by disturbing effects, e.g. residuals of adhesives or groovesat a wafer surface caused by grinding steps of manufacturing processes,e.g. a so called TAIKO process. For example, to avoid these groovesbeing detected as a false pre-aligning element by evaluating thereflected fractions of the illumination, a reliable first positioninformation is used to verify the second position information and toobtain an accurate position information. The second sensor signal may beevaluated or gathered during the whole pre-aligning process and, in casethe first position information indicates the pre-aligning element beingat least partially present within the first range of detection can beevaluated in combination with the first position information.Alternatively, the second sensor signal may be evaluated or gatheredonly in case the first position information indicates the pre-aligningelement being at least partially present within the first range ofdetection.

In case, the coarse position is fine enough for the currently evaluatedwafer and therefore fine enough for the currently evaluated pre-aligningelement, for example with respect to process parameters defined byfollowing process steps, the second position information can be used toverify the position information.

As the first position information indicates the coarse position of thepre-aligning element 12 within the first range of detection, theevaluation unit 42 is configured to match this first positioninformation with the second sensor signal 28-2.

In case the second sensor signal 28-2 indicates the position of thepre-aligning element 12 within the currently illuminated edge portionand the first position information indicates the pre-aligning element 12being at least partially located within the currently illuminated edgeportion, the second position information is determined by the evaluationunit 42. The second position information defines the position of thepre-aligning element 12 within a second range of detection. The secondrange of detection is equal or smaller than the first range ofdetection. By determining the presence of the pre-aligning element 12within an equal or smaller range of detection, the position informationmay be more detailed and/or finer. Therefore, by evaluating thereflected fractions 26-2 of the illumination a determination of theposition of the pre-aligning element 12 can be performed with a higherprecision.

Theoretically, the first and the second position information may havethe same or a comparable precision with respect to the position of thepre-aligning element 12, if no residuals of the adhesive are present inthe range of the pre-aligning element 12.

The first sensor signal 28-1 can be a degree of measured intensity orbrightness of the transmitted fraction 26-1 of the illumination forexample by a photo diode. The second sensor signal 26-2 can be realizedas a multi-pixel receiver or resolution sensor which is configured tooutput a video frame or a picture for example which may be evaluated bya mathematical algorithm for edge detection.

The sensor arrangement 22 does not define or require specific locationsfor illumination sources 32 or illumination sensors 34. Illuminated edgeportions of the wafer edge with respect to an illumination for creatingthe transmitted fractions 26-1 or the reflected fractions 26-2 can belocated adjacent to each other or maybe with an offset distance inbetween. In case of an offset distance between the illuminated edgeportions, two pairs of illumination sources and associated illuminationsensors may be used, one pair located at each illuminated edge portion.For obtaining the first position information, the appropriateillumination source 32 and the appropriate illumination sensor 34 arearranged on opposing sides of the wafer 16, so that the pre-aligningelement 12 can be located at least partially between the illuminationsource 32 and the illumination sensor 34. For obtaining the secondsensor signal 28-2, the appropriate illumination source 32 and theappropriate illumination sensor 34 are arranged on the same side of thewafer 16 so that a reflection of the illumination is sensed by theillumination sensor 32.

Embodiments of the sensor arrangement 22 are described in the following,wherein, for example, the illumination is generated by two illuminationsources 32-1 and 32-2 or the transmitted fractions 26-1 and thereflected fractions 26-2 of the illumination are sensed by twoillumination sensors 34-1 and 34-2.

The illumination source 32 may be a light sensor, for example a laser ora light emitting diode (LED), e.g. in an ultraviolet (UV) to infrared(IR) range. For creating the transmitted fraction 26-1 and the reflectedfraction 26-2 of the illumination, an illumination source 32-1 and 32-2may be arranged within the sensor arrangement 22. Alternatively oneillumination source 32 may be arranged to illuminate the edge portionsof the wafer 16 and to be the source for both, the transmitted fractions26-1 and the reflected fractions 26-2 of the illumination.

The first sensor signal 28-1 may be provided by a photo diode or amulti-pixel receiver which is configured to receive the transmittedfraction 26-1 of the illumination from the illuminated edge portion. Thepixels of the multi-pixel receiver may be arranged in a line-shapedmanner or in a multi-line manner. In case of an absence of thepre-aligning element within the currently evaluated edge portion, themulti-pixel receiver may receive the transmitted fraction 26-1 of theillumination and may provide data, e.g. picture data or a video frame,indicating a brightness of the picture of the multi-pixel receiver.Alternatively, the amount of the transmitted fractions 26-1 received bythe multi-pixel receiver may be close to zero in case of the absence ofthe pre-aligning element 12. In case of a presence of the pre-aligningelement within the currently evaluated edge portion, the amount of thetransmitted fraction 26-1 of the illumination may increase and thereforeresult in a changed information of the picture of the multi-pixelreceiver with respect to the brightness of the picture data as soon asparts of the pre-aligning element 12 start to be located within therange evaluated by the multi-pixel receiver.

The predefined threshold level indicating the pre-aligning element 12being present at least partially within the currently evaluated edgeportion may be defined in an absolute or in a relative manner. In anabsolute manner, for example the total brightness of a picture isdefined to be increased to more than 10%, 30%, 50% or 70% of a possiblemaximum in case of the pre-aligning element being located at leastpartially within the currently evaluated edge portion than in case of anabsence of the pre-aligning element. In a relative manner, for examplethe brightness of the picture is defined to be at least 20%, 50%, 70% or100% higher in case of the pre-aligning element being located at leastpartially within the currently evaluated edge portion than in case of anabsence of the pre-aligning element.

In general, the predefined threshold level may be defined in any waydepending on different parameters, e.g. the sensor type to be utilized,a sensor sensitivity or a layout of the sensor arrangement, for examplethe number of illumination sources or illumination sensors to bearranged at the sensor arrangement.

The second sensor signal 28-2 may be provided for example by amulti-pixel receiver, which enables the case that both sensor signals28-1 and 28-2 can be provided by the same device. In case both, thefirst and the second sensor signal 28-1 and 28-2 are provided by amulti-pixel receiver, the evaluation unit 42 may evaluate the firstsensor signal 28-1 for example in terms of brightness and afterwards,after the first position information indicates that the pre-aligningelement is at least partially present within the currently evaluatededge portion, switch to evaluate the second sensor signal and todetermine the second position information by evaluating the matching ofedges instead of an evaluation of brightness. Alternatively, theevaluation unit may be configured to buffer the signal provided by themulti-pixel receiver. When determining the second position informationthe second sensor signal 28-2 may be used in terms of reading thebuffered signal.

Alternatively, in case two illumination sensors 34-1 and 34-2 usedifferent sensing methods, for example a photo diode to receive thetransmitted fraction 26-1 and a multi-pixel receiver to receive thereflected fraction 26-2 of the illumination, the illumination sensors34-1 and 34-2 may be arranged next to each other and/or be locatedwithin one housing. Alternatively bot sensors 34-1 and 34-2 may belocated with a distance between each other.

FIG. 2 shows a schematic side view of an apparatus 20 for detecting thepre-aligning element 12 at the wafer edge of the wafer 16. The wafer 16is fixed to a wafer support 18 for carrying the wafer 16, wherein thewafer support 18 and the wafer 16 form a wafer arrangement 14. Thesensor arrangement 22 comprises a first illumination sensor 34-1configured to sense the transmitted fractions 26-1 of the illumination,a second illumination sensor 34-2 configured to sense the reflectedfractions 26-2 of the illumination, and the illumination source 32configured to illuminate subsequent edge portions 24 of the wafer edge.The illumination source 32 and the second illumination sensor 34-2 arearranged on the same side of the wafer arrangement 18. The firstillumination sensor 34-1 is arranged at the opposing side of the waferarrangement 14. The apparatus 20 further comprises an actuator 19configured to move the wafer 16 into a pre-alignment position and acontrol unit 21 configured to control the actuator 19 for pre-aligningthe wafer 16 based on the first and second position information. Thewafer 16 is rotatable with respect of an axis of rotation 35 forming acenter of rotation of the wafer 16 and therefore the pre-aligningelement 12 is movable with respect to the sensor arrangement 22. Thefirst or the second position information comprises a rotationinformation with respect of the pre-aligning element 12 and the centerof rotation, the rotation information defining the first positioninformation and/or the second position information in a polar coordinatesystem or a Cartesian coordinate system.

Such an embodiment as shown in FIG. 2 is able to reduce the requiredhardware and therefore the required costs as only one illuminationsource 32 has to be provided and the apparatus 20 requires less space.

The illumination source 32 and the second illumination sensor 34-2 arearranged at the side of the wafer 16 opposing the side of the wafer 16next to the wafer support 18. In some embodiments, the illuminationsource 32 and the second illumination sensor 34-2 are arranged at theside of the wafer arrangement 14, which is defined by the side of thewafer support 18 opposing the wafer 16.

FIG. 3 shows a schematic side view of an apparatus 30 for detecting thepre-aligning element 12 at the edge of the wafer 16. The sensorarrangement 22 comprises an illumination sensor 34 configured to sensethe transmitted fractions 26-1 and the reflected fractions 26-2 of theillumination, a first illumination source 32-1 configured to illuminatethe wafer edge for creating the transmitted fractions 26-1 of theillumination and a second illumination source 32-2 configured toilluminate the wafer edge for creating the reflected fractions 26-2 ofthe illumination. The second illumination source 32-2 and theillumination sensor 34 are arranged at the same side of the waferarrangement 14, wherein the first illumination source 32-1 is arrangedat the opposing side of the wafer arrangement 14. The secondillumination source 32-2 and the illumination sensor are arranged at theside of the wafer 16 opposing the side of the wafer 16 next to the wafersupport 18. In other embodiments the second illumination source 32-2 andthe illumination sensor are arranged at the side of the waferarrangement 14 defined by the side of the wafer support which is avertedfrom the wafer 16.

The illumination sensor 34 can be configured to output the first sensorsignal 28-1 and the second sensor signal 28-2 concurrently.Alternatively, the sensor can be configured to be switched fromoutputting the first sensor signal to outputting the second sensorsignal.

In alternative embodiments, two illumination sources and twoillumination sensors are arranged at the wafer to illuminate subsequentedge portions. The subsequent edge portions may be located with adistance between them.

FIG. 4a shows a cross-sectional view of an apparatus 40 for detecting apre-aligning element 12, e.g. a notch or a flat at the wafer 16 which iscarried by a wafer support 18. The wafer 16 comprises the pre-aligningelement 12 at a wafer edge. The sensor arrangement 22 is configured toilluminate subsequent edge portions 24-1 and 24-2 of the wafer edge andto receive the transmitted fractions 26-1 and the reflected fractions26-2 of the illumination from the illuminated edge portions 24-1 and24-2, and to output the first sensor signal 28-1 based on thetransmitted fractions 26-1 of the illumination and the second sensorsignal 28-2 based on the reflected fractions 26-2 of the illumination.The wafer edge is arranged between the first illumination source 32-1and the first illumination sensor 34-1 so that the amount of thetransmitted fractions 26-1 of the illumination is varying depending on ashape of the wafer edge. The illuminated edge portion 24-1 defines thefirst range of detection, wherein the illuminated edge portion 24-2defines the second range of detection. The sensor arrangement 22 furthercomprises the first illumination source 32-1 configured to illuminatethe wafer edge for creating the transmitted fractions 26-1 of theillumination and the second illumination source 32-2 configured toilluminate the wafer edge for creating the reflected fractions 26-2 ofthe illumination. The sensor arrangement 22 further comprises a firstillumination sensor 34-1 configured to sense the transmitted fractions26-1 of the illumination and to output the first sensor signal 28-1 anda second illumination sensor 34-2 configured to sense the reflectedfractions 26-2 of the illumination and to output the second sensorsignal 28-2.

The first illumination source 32-1, the second illumination source 32-2and the second illumination sensor 34-2 are arranged at a side of thewafer, opposing a side of the wafer which is facing the wafer support18, wherein the first illumination sensor 34-1 is arranged at theopposing side of the wafer arrangement 14.

The second illumination source 32-2 is also configured to emitillumination in the direction of the wafer 16, wherein the reflectedfractions 26-2 of the illumination are reflected by the wafer 16 atleast partially, so that the reflected fractions 26-2 vary dependent ona presence of the pre-aligning element within the illuminated wafer edgeportion 24-2.

FIG. 4b shows a schematic top view of apparatus 40. The waferarrangement 14 is rotatable with respect of an axis to rotation 35, sothat the position of the pre-aligning element 12 is variable withrespect to the sensor arrangement 22. The evaluation unit 42 isconfigured to evaluate the first sensor signal 28-1 and to determine thefirst position information with respect to the coarse position of thepre-aligning element 12 if the first sensor signal 28-1 indicates thatthe transmitted fractions 26-1 of the illumination have reached thepredetermined threshold value. The first position information indicatesthat the pre-aligning element 12 is at least partially located withinthe currently evaluated edge portion 24-1. The evaluation unit 42 isfurther configured to determine a second position information based onthe second sensor signal 28-2 and the first position information, afterthe evaluation unit 42 has determined the first position information.

In case, the first position information 28-1 indicated a presence of thepre-aligning element 12 within the illuminated edge portion 24-1, afurther rotation of the wafer arrangement 14 leads to a movement of thepre-aligning element 12. Based on the first position information theevaluation unit 42 evaluates the second sensor signal 28-2.

The first position information, indicating the coarse position of thepre-aligning element 12 at the wafer 16, e.g. with respect to aCartesian or an polar coordinate system, is considered when rotating thewafer 16 and moving the pre-aligning element 12 towards the edge portion24-2.

FIG. 5a shows a section of a top view on the pre-aligning element 12 ofthe wafer 16 carried by the wafer support 18 by being fixed to the wafersupport 18 by an adhesive 52 in an optimal case. The pre-aligningelement 12 forms an edge 44, a pathway of the edge 44 carrying theinformation of the position of the pre-aligning element 12. A centerpoint 46 of the pathway of the edge 44 defines a center 48 of thepre-aligning element 12. Regarding the edge 44 as a graph of a function,the center point 46 is defined by a maximum of the graph of thefunction.

After arranging the adhesive 52 at the wafer 16 or the wafer support 18,the wafer 16 is arranged at the wafer support 18. Portions of theadhesive 52 are oozed out when fixing the wafer 16 to the wafer support18 and form an edge 45 of the adhesive 52 which is not parallel to theedge 44. A distance 47 between the edges 44 and 45 along the center 48of the pathway of the edge 44 is not pre-defined but a result of thefixing of the wafer 16 to the wafer support 18 and may vary betweensingle wafers. The edge 45 being not parallel to the edge 44 reduces thedegree of matching between a pattern of the signal which is detected byan illumination sensor sensing the transmitted fractions of theillumination and a pre-defined pattern of an expected pattern of theedge 44 and therefore the accuracy of the method.

The remaining area 54 of the wafer arrangement 18 which is not coveredby either the wafer 16 or the adhesive 52 is configured to betransparent for the illumination generated by the illumination sourceconfigured to generate the transmitted fractions of the illumination.Thus, an illumination of the remaining area 54 of the wafer support 18leads to a varying intensity of the transmitted fractions of theillumination along the remaining area 54. A maximum of the intensity isarranged along the center 48 of the pathway of the edge 44 of thepre-aligning element 12. Thus, an evaluation of the intensity of thetransmitted fractions of the illumination leads to the first positioninformation in addition to the evaluation of the pattern of the signaloutputted by the illumination sensor.

FIG. 5b shows a section of a top view on the pre-aligning element 12 ofa realistic scenario, wherein the attachment of the wafer 16 to thewafer support 18 leads the adhesive 52 to ooze out of the range of thewafer support 18 covered by the wafer 16 and further to form surpluses56-1, 56-2 and 56-3. The surpluses 56-1, 56-2 and 56-3 cover additionalareas of the wafer support 18, leading to a reduction of the remainingarea 54 of the wafer support 18. The areas which are covered by thesurpluses 56-1, 56-2 and 56-3 are distributed statistically. Thus, theintensity of the transmitted fractions of the illumination at a locationor an area is changed, e.g. reduced statistically.

As a result the presence of the pre-aligning element 12 is can bedetermined by the evaluation unit 42, when evaluating the first sensorsignal 28-1 based on the transmitted fractions 26-1 of the illuminationwith a low error rate.

To obtain a finer and/or more precise position information, theevaluated area of the pre-aligning element 12 is afterwards evaluatedutilizing the second sensor signal 28-2 by the evaluation unit 42 whichthen may detect the edge 44 of the pre-aligning element 12 including thepathway of the edge 44 while avoiding false detections of grooves causedby steps during preprocessing.

FIG. 6 shows a flowchart of a method 100 for detecting a pre-aligningelement at a wafer, the wafer having the pre-aligning element at a waferedge. In a first step 101, subsequent edge portions of the wafer edgeare illuminated with a sensor arrangement, transmitted fractions andreflected fractions of the illumination from the illuminated edgeportion are received with an illumination sensor, and a first and asecond sensor signal are outputted, wherein the first sensor signal isbased on the transmitted fractions of the illumination and the secondsensor signal is based on the reflected fractions of the illumination.In a second step 102, the first sensor signal is evaluated with anevaluation unit and a first position information is determined withrespect to a coarse position of the pre-aligning element if the firstsensor signal indicates that the transmitted fractions of theillumination have reached a predetermined threshold value, wherein thefirst position information indicates that the pre-aligning element is atleast partially located within the currently evaluated edge portion. Ina third step 103, after having determined the first positioninformation, a second position information based on the second sensorsignal and the first position information is determined, wherein thesecond position information indicates the fine position of thepre-aligning element.

FIG. 7 shows a flowchart of a method 200 for detecting a pre-aligningelement at a wafer with an apparatus, the wafer having the pre-aligningelement at a wafer edge. In a first step 201, subsequent edge portionsof the wafer edge are illuminated with a sensor arrangement, transmittedfractions and reflected fractions of the illumination are received fromthe illuminated edge portions with an illumination sensor, and a firstand a second sensor signal are outputted, wherein the first sensorsignal is based on the transmitted fractions of the illumination and thesecond sensor signal is based on the reflected fractions of theillumination. The first sensor signal is evaluated with an evaluationunit and a first position information is determined with respect to acoarse position of the pre-aligning element if the first sensor signalindicates that the transmitted fractions of the illumination havereached a predetermined threshold value, wherein the first positioninformation indicates that the pre-aligning element is at leastpartially located within the currently evaluated edge portion. Afterhaving determined the first position information, a second positioninformation based on the second sensor signal and the first positioninformation is determined, wherein the second position informationindicates the fine position of the pre-aligning element. In a secondstep 202, an actuator is controlled based on the pre-alignment signalfor moving the wafer into a pre-alignment position with the actuator.The pre-alignment signal accounts for an actual position of the actuatorand the first position information as the first position information isevaluated for example to decide the direction or the speed the actuatoris to be moved. A control unit is configured to control the actuator forpre-aligning the wafer based on the first and second positioninformation.

The inventive concept may be realized in the form of hardware andsoftware modifications at a pre-aligner unit of a wafer stepper.

The hardware and software modifications for performing a pre-alignmentbased on a detection of the pre-aligning element 12 with a stepper,steppers are adapted that a reliable coarse detection of thepre-aligning element proceeds with optics utilizing transmittedillumination and afterwards for performing an accurate positioning andmeasurement of the shape of the pre-aligning element the operating modeis switched to using optics utilizing a reflected illumination.

Although some aspects have been described in the context of anapparatus, it is clear that these aspects also represent a descriptionof the corresponding method, where a block or device corresponds to amethod step or a feature of a method step. Analogously, aspectsdescribed in the context of a method step also represent a descriptionof a corresponding block or item or feature of a correspondingapparatus.

Depending on certain implementation requirements, embodiments of theinvention can be implemented in hardware or in software. Theimplementation can be performed using a digital storage medium, forexample a floppy disk, a DVD, a CD, a ROM, a PROM, an EPROM, an EEPROMor a FLASH memory, having electronically readable control signals storedthereon, which cooperate (or are capable of cooperating) with aprogrammable computer system such that the respective method isperformed.

Some embodiments according to the invention comprise a data carrierhaving electronically readable control signals, which are capable ofcooperating with a programmable computer system, such that one of themethods described herein is performed.

Generally, embodiments of the present invention can be implemented as acomputer program product with a program code, the program code beingoperative for performing one of the methods when the computer programproduct runs on a computer. The program code may for example be storedon a machine readable carrier.

Other embodiments comprise the computer program for performing one ofthe methods described herein, stored on a machine readable carrier.

In other words, an embodiment of the inventive method is, therefore, acomputer program having a program code for performing one of the methodsdescribed herein, when the computer program runs on a computer.

A further embodiment of the inventive methods is, therefore, a datacarrier (or a digital storage medium, or a computer-readable medium)comprising, recorded thereon, the computer program for performing one ofthe methods described herein.

A further embodiment of the inventive method is, therefore, a datastream or a sequence of signals representing the computer program forperforming one of the methods described herein. The data stream or thesequence of signals may for example be configured to be transferred viaa data communication connection, for example via the Internet.

A further embodiment comprises a processing means, for example acomputer, or a programmable logic device, configured to or adapted toperform one of the methods described herein.

A further embodiment comprises a computer having installed thereon thecomputer program for performing one of the methods described herein.

In some embodiments, a programmable logic device (for example a fieldprogrammable gate array) may be used to perform some or all of thefunctionalities of the methods described herein. In some embodiments, afield programmable gate array may cooperate with a microprocessor inorder to perform one of the methods described herein. Generally, themethods are preferably performed by any hardware apparatus.

The above described embodiments are merely illustrative for theprinciples of the present invention. It is understood that modificationsand variations of the arrangements and the details described herein willbe apparent to others skilled in the art. It is the intent, therefore,to be limited only by the scope of the impending patent claims and notby the specific details presented by way of description and explanationof the embodiments herein.

What is claimed is:
 1. An apparatus for detecting a pre-aligning elementat a wafer, the wafer having the pre-aligning element at a wafer edge,the apparatus comprising: a sensor arrangement configured to illuminatesubsequent edge portions of the wafer edge, to receive transmittedfractions and reflected fractions of the illumination from theilluminated edge portions, and to output a first and a second sensorsignal, wherein the first sensor signal is based on the transmittedfractions of the illumination and the second sensor signal is based onthe reflected fractions of the illumination; and an evaluation unitcomprising a programmable logic device and configured to evaluate thefirst sensor signal and to determine a first position informationindicating a coarse position of the pre-aligning element, when the firstsensor signal indicates that the transmitted fractions of theillumination have reached a predetermined threshold value, wherein thefirst position information indicates that the pre-aligning element is atleast partially located within a currently evaluated edge portion, and,after having determined the first position information, to determine asecond position information based on the second sensor signal and thefirst position information, wherein the second position informationindicates a fine position of the pre-aligning element, wherein the firstposition information indicates the position of the pre-alignment elementwithin a first range of detection, wherein the second positioninformation indicates the position of the pre-alignment element within asecond range of detection, and wherein the second range of detection isequal or smaller than the first range of detection.
 2. The apparatusaccording to claim 1, wherein the sensor arrangement comprises a firstillumination sensor configured to sense the transmitted fractions of theillumination, a second illumination sensor configured to sense thereflected fractions of the illumination, and an illumination sourceconfigured to illuminate the subsequent edge portions of the wafer edge,wherein the illumination source and the second illumination sensor arearranged on the same side of the wafer, and wherein the firstillumination sensor is arranged at an opposing side of the wafer.
 3. Theapparatus according to claim 1, wherein the sensor arrangement comprisesan illumination sensor configured to sense the transmitted fractions andthe reflected fractions of the illumination, a first illumination sourceconfigured to illuminate the wafer edge for creating the transmittedfractions of the illumination and a second illumination sourceconfigured to illuminate the wafer edge for creating the reflectedfractions of the illumination, wherein the second illumination sourceand the illumination sensor are arranged at the same side of the wafer,and wherein the first illumination source is arranged at an opposingside of the wafer.
 4. The apparatus according to claim 1, wherein thesensor arrangement comprises a first illumination sensor configured tosense the transmitted fractions of the illumination, a secondillumination sensor configured to sense the reflected fractions of theillumination, a first illumination source configured to illuminate thewafer edge for creating the transmitted fractions of the illuminationand a second illumination source configured to illuminate the wafer edgefor creating the reflected fractions of the illumination, wherein thefirst and the second illumination sensor are arranged at the same sideof the wafer and wherein the first illumination source is arranged atone side of the wafer and the second illumination source is arranged atan opposing side of the wafer.
 5. The apparatus according to claim 1,wherein the apparatus is configured to detect the pre-aligning elementin form of a notch or a flat at the wafer edge.
 6. A pre-alignmentsystem comprising: an apparatus according to claim 1; an actuatorconfigured to move the wafer into a pre-alignment position; and acontrol unit comprising a programmable logic device and configured tocontrol the actuator for pre-aligning the wafer based on the first andsecond position information.
 7. The pre-alignment system according toclaim 6, wherein the sensor arrangement comprises a first illuminationsensor configured to sense the transmitted fractions of theillumination, a second illumination sensor configured to sense thereflected fractions of the illumination, and an illumination sourceconfigured to illuminate the subsequent edge portions of the wafer edge,wherein the illumination source and the second illumination sensor arearranged on the same side of the wafer, and wherein the firstillumination sensor is arranged at an opposing side of the wafer.
 8. Thepre-alignment system according to claim 6, wherein the sensorarrangement comprises an illumination sensor configured to sense thetransmitted fractions and the reflected fractions of the illumination, afirst illumination source configured to illuminate the wafer edge forcreating the transmitted fractions of the illumination and a secondillumination source configured to illuminate the wafer edge for creatingthe reflected fractions of the illumination, wherein the secondillumination source and the illumination sensor are arranged at the sameside of the wafer, and wherein the first illumination source is arrangedat an opposing side of the wafer.
 9. The pre-alignment system accordingto claim 6, wherein the sensor arrangement comprises a firstillumination sensor configured to sense the transmitted fractions of theillumination, a second illumination sensor configured to sense thereflected fractions of the illumination, a first illumination sourceconfigured to illuminate the wafer edge for creating the transmittedfractions of the illumination and a second illumination sourceconfigured to illuminate the wafer edge for creating the reflectedfractions of the illumination, wherein the first and the secondillumination sensor are arranged at the same side of the wafer, andwherein the first illumination source is arranged at one side of thewafer and the second illumination source is arranged at an opposing sideof the wafer.
 10. The pre-alignment system according to claim 6, whereinthe first position information indicates the position of thepre-alignment element within a first range of detection, wherein thesecond position information indicates the position of the pre-alignmentelement within a second range of detection, and wherein the second rangeof detection is equal or smaller than the first range of detection. 11.A method for detecting a pre-aligning element at a wafer, the waferhaving the pre-aligning element at a wafer edge, the method comprising:illuminating subsequent edge portions of the wafer edge with a sensorarrangement, receiving transmitted fractions and reflected fractions ofthe illumination from the illuminated edge portion with an illuminationsensor, and outputting a first and a second sensor signal, wherein thefirst sensor signal is based on the transmitted fractions of theillumination and the second sensor signal is based on the reflectedfractions of the illumination; and evaluating the first sensor signaland determining a first position information with respect to a coarseposition of the pre-aligning element if the first sensor signalindicates that the transmitted fractions of the illumination havereached a predetermined threshold value, wherein the first positioninformation indicates that the pre-aligning element is at leastpartially located within a currently evaluated edge portion, and, afterhaving determined the first position information, determining a secondposition information based on the second sensor signal and the firstposition information, wherein the second position information indicatesa fine position of the pre-aligning element, wherein the first positioninformation indicates the position of the pre-alignment element within afirst range of detection, wherein the second position informationindicates the position of the pre-alignment element within a secondrange of detection, and wherein the second range of detection is equalor smaller than the first range of detection.
 12. The method accordingto claim 11, wherein the transmitted fractions of the illumination arereceived with a first illumination sensor and the reflected fractions ofthe illumination sensor are received with a second illumination sensor,and wherein the subsequent edge portions are illuminated with anillumination source.
 13. The method according to claim 11, wherein thetransmitted and the reflected fractions of the illumination are receivedwith an illumination sensor, and wherein the subsequent edge portionsare illuminated with a first illumination source for creating thetransmitted fractions of the illumination and a second illuminationsource for creating the reflected fractions of the illumination.
 14. Themethod according to claim 11, wherein the transmitted fractions of theillumination are received with a first illumination sensor and thereflected fractions of the illumination sensor are received with asecond illumination sensor, and wherein the subsequent edge portions areilluminated with a first illumination source for creating thetransmitted fractions of the illumination and a second illuminationsource for creating the reflected fractions of the illumination.
 15. Themethod according to claim 11, further comprising detecting thepre-aligning element in form of a notch or a flat at the wafer edge. 16.The method for pre-aligning a wafer, further comprising: detecting apre-aligning element at a wafer according to claim 11; and controllingan actuator based on the first and second position information formoving the wafer into a pre-alignment position with the actuator.
 17. Anon transitory storage medium having stored thereon a computer programhaving a program code for performing, when running on a computer, amethod for detecting a pre-aligning element at a wafer, the wafer havingthe pre-aligning element at a wafer edge, the method comprising:illuminating subsequent edge portions of the wafer edge with a sensorarrangement, receiving transmitted fractions and reflected fractions ofthe illumination from the illuminated edge portion with an illuminationsensor, and outputting a first and a second sensor signal, wherein thefirst sensor signal is based on the transmitted fractions of theillumination and the second sensor signal is based on the reflectedfractions of the illumination; and evaluating the first sensor signaland determining a first position information with respect to a coarseposition of the pre-aligning element if the first sensor signalindicates that the transmitted fractions of the illumination havereached a predetermined threshold value, wherein the first positioninformation indicates that the pre-aligning element is at leastpartially located within a currently evaluated edge portion, and, afterhaving determined the first position information, determining a secondposition information based on the second sensor signal and the firstposition information, wherein the second position information indicatesa fine position of the pre-aligning element, wherein the first positioninformation indicates the position of the pre-alignment element within afirst range of detection, wherein the second position informationindicates the position of the pre-alignment element within a secondrange of detection, and wherein the second range of detection is equalor smaller than the first range of detection.